TSV Package Technology: Samsung’s 30nm-class 32GB Green DDR3 for Next-generation Servers breaks the records!
Elena Vnorovscaia / Chişinău / Moldova.ORG / -- The advanced memory technology leader, Samsung Electronics Co., Ltd., announced the development of 32 gigabyte (GB) double data rate-3 (DDR3) registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) through silicon via (TSV) package technology.
"These 32GB RDIMMs fully support the high-density and high-performance requirements of next-generation high-capacity servers. We will keep providing memory solutions with higher performance and density, while enhancing shared value in the design of ever-greener server systems," said Wanhoon Hong, executive vice president, memory sales & marketing, Device Solutions, Samsung Electronics.
The new 32GB RDIMM with 3D TSV package technology is based on Samsung's 30nm-class four gigabit (Gb) DDR3. It can transmit at speeds of up to 1,333 megabits per second (Mbps), a 70 percent gain over preceding quad-rank 32GB RDIMMs with operational speeds of 800Mbps.
In addition, the 32GB-module consumes a mere 4.5 watts per hour - the lowest power consumption level among memory modules adopted for use in enterprise servers. The new 32GB module provides approximately 30 percent additional energy savings.
These savings are directly attributable to the adoption of TSV technology, which enables a multi-stacked chip to function at levels comparable to a single silicon chip by shortening signal lines significantly, thereby lowering power consumption and achieving higher density and operational speed.
Samsung has worked with CPU and controller designers in addition to some current server system customers to provide quicker adoption of 3D-TSV server modules, and to prepare the way for more easily supporting 32GB and higher-density memory modules based on 20nm-class DDR3 for use in high-capacity servers.